The AI chip giant has taken the wraps off its latest compute platform designed for test-time scaling and reasoning models, alongside a slew of open source models for robotics and autonomous driving ...
AMD also is updating its workstation-level Ryzen AI Max+ mobile processors with two new models: the 12-core Ryzen AI Max+ 392 ...
Qualcomm Technologies introduced a next-generation robotics architecture at CES 2026, featuring the Dragonwing™ IQ10 Series ...
Tesla CEO Elon Musk has shared his thoughts on Nvidia’s newly unveiled Vera Rubin chips, revealed at CES 2026. While Musk ...
Jensen Huang took to the CES stage on Monday to share the latest from NVIDIA, and while the presentation was more a refresher ...
At CES 2026, GIGABYTE is unlocking the full potential of AMD Ryzen™ 9000 Series Processors with AMD 3D V-Cache technology.
Intel's Core Ultra Series 3 processors, built on its new 18A architecture, was just officially unveiled at CES.
Software-defined ISP replaces fixed hardware with neural networks, promising real-time image quality gains and over-the-air ...
Expanded collaboration with Red Hat to deliver a complete AI stack optimized for the Rubin platform with Red Hat Enterprise ...
PCMag Australia on MSN
Qualcomm Launches Snapdragon X2 Plus Chips for Mainstream Laptops: Here Are the First Test Numbers
At CES 2026, the big maker of mobile chips teased details—and some benchmarks—for its new mainstream Snapdragon processor ...
Zacks.com on MSN
Can Intel's Xeon 6900 Processors Drive Long-Term Growth?
INTC boosts server CPU leadership as Xeon 6900 powers SMCI's 6U SuperBlade, delivering up to 128 cores, faster DDR5, and ...
Press Trust of India on MSN
Innodisk unveils the new AI on Dragonwing computing series with the first EXMP-Q911 COM-HPC mini module powered by Qualcomm's SoC
The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...
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