Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
if you don't like how the formatter laid out your code, you may need to introduce new functions/variables the formatter is not as clever as humans are, so it can sometimes produce less readable code ...
Abstract: This letter presents a new approach for applying orthogonal code-division multiplex encoding to current-mode sensor arrays with analog-domain encoding directly in the column readout ...
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